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Use this part of the tutorial to simulate the RF
performance of your circuit. You
need to include the lengths of all lines (including the pads for soldering
elements to). These are found in
the layout section, so you will do some back-and-forth between layout and
simulation. |
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Some elements are available in the standard
libraries (the cap in this lab), others are not (the diode in this
lab). When they are not available,
you will have to “create” them using user-defined S-parameters and lines
(MLIN). These can come from data
sheets (like the HP website) or from measurements (like for this lab). |
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“Artwork” is used to define the size and shape
of solder connects for components like capacitors, diodes, RF chips, etc. |
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The dimensions of solder pads (where you
actually connect your circuit) are specified on data sheets. They are also available in the libra
“library” for many standard elements. |
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The size of pads add length to your lines, so
you will need to include them in your simulation for most accurate
results. This means you need to
figure out their size before you simulate the circuit, so you will do some
back-and-forth between layout and simulation. |
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Measure them (most accurate) |
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Find them on the web or other data sheet (we’d
like this to be most accurate, but for this lab it isn’t) |
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These methods are described below, for your
reference. Measured values are
given at the end. |
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Build the circuit with just a length of line
attached to the device. |
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Measure the input impedance using the network
analyzer. |
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Compensate for the length of the line to find
the S-parameters of your device (Matlab code to do this is included) |
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You have now simulated how your circuit should
work, but you can’t mill it. The
mill will not know what to do with the S2P element and won’t leave any
particular solder pads for the capacitor. |
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In this part of the tutorial, you will prepare
the circuit to be soldered, but won’t be able to simulate its performance. |
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“Artwork” is used to define the size and shape
of solder connects for components like capacitors, diodes, RF chips, etc. |
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The dimensions of solder pads (where you
actually connect your circuit) are specified on data sheets. They are also available in the ADS
“library” for many standard elements. |
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The size of pads add length to your lines, so
you will need to include them in your simulation for most accurate
results. This means you need to
figure out their size before you simulate the circuit, so you will do some
back-and-forth between layout and simulation. |
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Remove all parts that will be soldered on (diode
and capacitor) before saving the file to be milled. |
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If you don’t, it will “mill” their outline and
mess up your board. |
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Design two diode detectors, one for 2.4 GHz, and
the other for 2.4 GHz. (Slight
change in single stub match.) |
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Print out the layout of your diode detectors,
with sizes clearly marked. |
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Clearly mark where holes for shorts should go
(there will be two on each detector). |
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If you didn’t “get” something in this tutorial,
please tell Dr. Furse or You Chung which slide(s) is confusing. |
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Thank you! |
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